Intel I3 8Th Generation Processor With Motherboard Price - Thinvent

Intel I3 8Th Generation Processor With Motherboard Price

Understanding Intel Core i3 8th Generation Processors and Motherboards

The query for an "Intel i3 8th Generation Processor with Motherboard Price" typically refers to building or purchasing a desktop computer system. The 8th Generation Intel Core i3 processors (like the i3-8100) were a significant leap, introducing quad-core designs to the i3 lineup for the first time. These CPUs use the LGA 1151 socket (300-series) and require a compatible 300-series chipset motherboard, such as the H310, B360, H370, or Z370. As a manufacturer focused on integrated computing solutions, Thinvent utilizes more recent, efficient, and powerful processor generations in our pre-configured systems, offering better performance, modern connectivity, and longer-term support than older desktop components.

For users considering an 8th Gen i3 desktop setup, key specifications to note include a core count of 4 cores (without Hyper-Threading), base clock speeds around 3.6 GHz, and support for DDR4 memory. These processors are well-suited for basic to moderate computing tasks. Common use cases include general office productivity (word processing, spreadsheets, email), web browsing with multiple tabs, entry-level photo editing, and as a platform for learning programming or basic computer skills. They can also serve as a reliable foundation for point-of-sale systems or basic home servers.

When comparing an older 8th Gen desktop setup to a modern Thinvent mini PC with a 12th or 13th Gen i3, the differences in architecture and efficiency are substantial. The newer mobile processors in our systems, like the i3-1215U/1315U, feature a hybrid architecture with more efficient cores, superior integrated graphics (Intel UHD Graphics vs. older UHD Graphics 630), and support for technologies like PCIe 4.0. The table below highlights a key comparison:

Feature Intel Core i3-8100 (8th Gen Desktop) Intel Core i3-1315U (in Thinvent Systems)
Cores/Threads 4 Cores, 4 Threads 6 Cores (2P + 4E), 8 Threads
Max Turbo Frequency N/A (3.6 GHz base) Up to 4.5 GHz
Integrated Graphics Intel UHD Graphics 630 Intel UHD Graphics (based on Xe architecture)
Manufacturing Process 14nm 10nm (Intel 7)
Typical Use Case Basic Desktop Tower Compact, Fanless/Mini PC for Diverse Environments

Thinvent's Advanced Mini PCs with Modern Intel Core i3 Power

Thinvent, as a reliable manufacturer with Indian roots serving a global customer base, integrates the latest Intel Core i3 processor technology into our robust, ready-to-deploy mini PC systems. We move beyond the traditional motherboard+CPU paradigm by offering fully engineered solutions that embed processors like the 12th Gen (Alder Lake) i3-1215U and 13th Gen (Raptor Lake) i3-1315U directly onto compact, industrial-grade motherboards within our enclosures. This approach eliminates compatibility concerns and delivers a complete, tested, and power-efficient product.

Our range of systems featuring these modern 6-core i3 processors is designed for a wide spectrum of professional and industrial applications. The Thinvent Aero and Treo Mini PCs are perfect for digital signage, interactive kiosks, and office workstations, offering a silent, space-saving footprint. The Thinvent Industrial PC IPC3 series is built for demanding environments, capable of running automation, machine vision, and in-vehicle computing tasks. For advanced edge computing and networking applications, the Thinvent Neo H and Neo R/4 models provide enhanced connectivity and rugged reliability.

Each Thinvent product is highly configurable. As seen in our sample listings, you can choose between operating systems like Windows 11 Pro, Ubuntu Linux, or our own Thinuxā„¢ Embedded Linux. Memory can be scaled from 4GB to 32GB DDR4, and storage options are available. This flexibility allows you to tailor a system precisely to your performance and software requirements, ensuring you get optimal value from the modern Intel Core i3 platform without the hassle of component sourcing and assembly.

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