What Is H9HCNNNFAMMLXR-NEE?
H9HCNNNFAMMLXR-NEE is the manufacturer part number for an SK Hynix LPDDR4X SDRAM memory chip. It is a single BGA-packaged IC — not a finished module — carrying 8GB of LPDDR4X memory running at 4266 Mbps per pin, housed in a 200-ball FBGA package. The "H9H" prefix is Hynix's designator for mobile/low-power DRAM, "CNN" indicates the LPDDR4X family, and the suffix identifies the speed grade, density and package. Because it is a bare chip, it is soldered directly onto a board rather than slotted into a DIMM socket.
Why LPDDR4X Matters
LPDDR4X ("LP" = low power, "4X" = the reduced-voltage revision of LPDDR4) runs its I/O at roughly 0.6V instead of 1.1V, cutting memory power consumption substantially while keeping the same 4266 Mbps data rate. That combination — high bandwidth with low power draw and low heat — is why LPDDR4X is the memory of choice in fanless mini PCs, thin clients, industrial controllers, tablets, routers and single-board computers. Soldered-down LPDDR4X also improves mechanical reliability: no socket, no retention clips, no vibration-loosened contacts.
Key Specifications
| Attribute | Detail |
|---|---|
| Part number | H9HCNNNFAMMLXR-NEE |
| Manufacturer | SK Hynix |
| Memory technology | LPDDR4X SDRAM |
| Density | 8GB per chip |
| Data rate | 4266 Mbps per pin |
| Package | 200-ball FBGA |
| Voltage | ~0.6V I/O (low power) |
| Form | Bare IC, board-mounted (not a DIMM module) |
Note that some distributor listings quote this part with differing density figures; always confirm density, speed grade and package against the official Hynix datasheet before designing it in.
Where This Memory Is Used
LPDDR4X at this density suits compact, sealed, always-on devices: industrial panel PCs, digital signage players, kiosk terminals, thin-client endpoints, medical and retail terminals, and embedded gateways. Designers choose it when they need several gigabytes of fast RAM in a board area too small for SO-DIMM slots and when the enclosure has no fan — because low power draw means less heat to remove.
Thinvent Products Built Around Low-Power Memory
Thinvent designs its Mini PCs, thin clients, all-in-one PCs and industrial computers around soldered, low-power memory paired with efficient Intel® processors. The Thinvent® Aero Mini PC, for example, combines an Intel® processor N5095A (4 cores, up to 2.9 GHz, 4 MB cache) with 16GB DDR4 RAM and 128GB SSD storage, drawing power from a small 12V 5A adapter — the same design philosophy of quiet, low-heat, reliable operation that makes LPDDR4X popular in embedded systems. Thinvent platforms ship with Windows 11 IoT, Windows 11 Pro, DOS or Thinux™ Embedded Linux, and are built for continuous duty in offices, factories, retail floors and remote sites.
