What Is the H9TQ27ABJTMC?
The H9TQ27ABJTMC is a memory integrated circuit manufactured by SK Hynix. It belongs to the company's H9TQ family of embedded memory devices, which are multi-chip packages (MCP) that combine eMMC NAND flash storage with low-power DRAM in a single BGA (ball grid array) package. In the H9TQ27ABJTMC, the storage side of the package is a 32 GB eMMC device, as listed by component distributors under the SK Hynix eMMC category.
The "TQ" series naming convention is used by SK Hynix for eMMC-based embedded memory solutions. These chips are soldered directly onto a board rather than plugged into a socket, which makes them a common choice for compact, embedded and industrial hardware where shock, vibration and space constraints rule out conventional DIMM or SO-DIMM modules.
How the Part Number Decodes
SK Hynix memory part numbers encode density, package and interface information in a structured way. For MCP-style parts, the same package carries both a flash (storage) die and a DRAM (working memory) die. The related SK Hynix part H9TQ52ACLTMC, for example, is documented as a 64 GB eMMC plus 4 GB LPDDR3 combination, and component datasheets often state DRAM capacity in gigabits (Gb) rather than gigabytes (GB) — 32 Gb equals 4 GB. This is the single most common source of confusion when reading these part numbers.
| Attribute | Detail |
|---|---|
| Manufacturer | SK Hynix |
| Family | H9TQ series (eMMC + LPDDR multi-chip package) |
| Storage capacity (this part) | 32 GB eMMC |
| Package type | BGA, board-soldered |
| Typical interface | eMMC (managed NAND) with parallel LPDDR DRAM |
| Typical voltage | Low-power, embedded-class rails |
